The memory maker’s upcoming production volumes for its core chip products are now nearly entirely reserved by customers. SK Hynix said it has virtually sold out its DRAM and High Bandwidth Memory (HBM) output through 2029, meaning its shipments for these components are fully committed for the next three years.
Long-term agreements already cover about 50% of the chipmaker’s 2027 and 2028 capacity. The company expects these contracts to maintain a similar share of its total output for the foreseeable future.
