Order visibility for TSMC now extends through 2030, with sub-45nm capacity fully loaded and 8-inch fab utilization exceeding 100%. This tight capacity is driven by demand for AI-related GPUs, ASICs, HBM and advanced packaging, while the cost of building fabs in the US is 4 to 5 times higher than in Taiwan. TSMC declined to comment on the report, though rival foundries are likely to follow the pricing adjustments.
