CEO Jensen Huang described the current expansion as the largest infrastructure buildout in human history, noting that capacity has become the primary constraint as demand for AI remains extraordinary. These investments across the U.S., Taiwan, South Korea, Japan, and Singapore are intended to strengthen supply chain resiliency. Nvidia expects its total testing capacity to double from 2026 to 2027 to support current and next-generation AI platforms.
Friday, October 23, 2026
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Nvidia and 6 Partners Expand AI Capacity With 300% Packaging Boost
AI2 days ago
The company is providing a $1.1 billion capacity reservation advance to KYEC to build new semiconductor testing facilities in the U.S., with high-volume production targeted for April 2027. Under agreements announced at GTC Berlin, Amkor will increase advanced packaging interposer wafer capacity in South Korea by more than 300% by the end of 2028, and SPIL will expand optical-engine capacity 15x by mid-2027 before doubling it again by 2028. IBIDEN, Samsung Electro-Mechanics, and Unimicron will also grow substrate capacity 2.5x over the next three years.
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