The partners will demonstrate the technology at ECOC 2026 in Málaga to support co-packaged optics and near-packaged optics architectures. By moving optics closer to the chip, the system addresses bandwidth density limits inherent in copper at board-level scales. Qualcomm shares rose more than 8% following the announcement, with technical roadmaps pointing to 4 Tb/s/mm density through higher lane rates.
Tuesday, October 20, 2026
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Qualcomm Shares Jump 8% on New 10 Tb/s AI Data Center Interconnect
Tech29 days ago
Lumentum and Corning collaborated with Qualcomm to create a high-density optical die-to-die link meant for low-power chip communication in AI systems. The architecture targets roughly 10 Tb/s of bandwidth and utilizes a 1060 nm VCSEL platform combined with multimode fiber. A prototype version of the system currently reaches a shoreline bandwidth density of 1 Tb/s/mm.
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