These investments build on GTC Berlin commitments to address supply chain constraints through a more than 300% increase in Amkor's advanced packaging capacity by 2028 and a 15x boost in SPIL's optical-engine manufacturing by mid-2027. Other agreements with IBIDEN and Unimicron aim to lift substrate capacity 2.5x over three years, and a $1.1B advance will fund new KYEC testing facilities in the U.S. by April 2027. CEO Jensen Huang stated that capacity is the primary constraint as demand for AI infrastructure remains extraordinary.
Friday, October 23, 2026
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Nvidia Expands Amkor AI Packaging Deal to $3B
Business1 day ago
Tesla and Nvidia will invest $2.8B in a Samsung Electro-Mechanics plant to establish dedicated production lines in Sejong and Busan, according to Korean media. Nvidia also expanded its agreement with Amkor Technology to $3B to secure AI packaging capacity, a move that pushed Amkor shares 8.4% higher in premarket trading. Samsung Electro-Mechanics additionally signed the largest substrate contract in its company history with Nvidia for chips and networking switches.
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