The agreement allows TSMC to procure the hardware within the United States for the first time. This partnership focuses on the manufacture of silicon interposers, which are necessary components for AI packaging processes.
Tuesday, October 20, 2026
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GlobalFoundries Signs $2B TSMC Deal to Make First US AI Interposers
Business13 days ago
Production of silicon interposers will begin at a New York site through a collaboration between GlobalFoundries and TSMC. The 5 year contract is valued at $2B and establishes the first domestic source of this specific component used in AI packaging, with volume production ramping in 1H 2028.
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