The processor complements the Helion agentic AI rack, an open-specification design arriving in November 2026. The Helion platform allows for configurations without GPUs to handle CPU-heavy agent tasks like code execution and tool calls, supporting up to 32,768 cores per rack via 128 EPYC "Venice" chips. Partners including Dell, HPE, Supermicro, and Cisco are supporting the rack, which includes a token router to direct requests to the most cost-effective AI models.
Tuesday, October 20, 2026
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AMD Debuts 6th Gen EPYC Verano CPU for AI Agent Scaling
AI8 days ago
The new 'Verano' data center processor featuring an LPDDR memory interface will be available in 2027 to support large-scale agentic AI deployments, AMD CEO Lisa Su announced at the OCP 2026 Global Summit. This 6th Gen EPYC chip is designed to address memory bandwidth constraints during AI training and inference. Su stated that the diversification of AI agents requires a variety of compute types, positioning AMD's CPU portfolio as the foundation for these workloads.
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