Wednesday, October 21, 2026
Saga
GlobalFoundries-TSMC U.S. AI interposer production deal
Overview
Description GlobalFoundries and TSMC have agreed to produce silicon interposers in New York as a domestic U.S. source for AI packaging components. Overview GlobalFoundries signed a five-year collaboration with TSMC valued at $2 billion to make silicon interposers at a New York site. The agreement gives TSMC a U.S. source for AI…
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Stories in this saga
1 story, 3 sources
Oct 14, 2026
GlobalFoundries to Build 2 Chip Fabs in NY With Up to $21B in Funding From U.S.-Japan Initiative
- GlobalFoundries Gets $21B from Japan for 2 New York Chip Plants7 days ago
- US Government Boosts GlobalFoundries Stake to 7% in $21B Japan Chip Deal